PBGA package substrate (Computers - Hardware)

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Item ID 1085551 in Category: Computers - Hardware

PBGA package substrate




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BGA or ball grid array substrates are widely used in the packaging of ICs, ASICs, GPUs, and other multifaceted parts. By allowing a high number of contacts in a limited space it facilitates miniaturization and performance improvements across most forms of electronics. It is important to note, however, that the design of products using and the manufacturing of PBGA package substrate involves fairly complex knowledge.

Contact Info:-

High Quality PCB Co., Limited

Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China

Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China

Plant 2 address: Zhuhai, Guangdong, China

Plant 3 address: Dongguan, Guangdong, China

TEL: +86-755-23724206

WhatsApp: +86-189 2381 2997

Skype: shawnwang2006

Email: sales@efpcb.com



Target Nation: All Nations
Target City : Shenzhen
Last Update : 08 October 2024 6:58 AM
Number of Views: 62
Item  Owner  : Shawn Wang
Contact Email:
Contact Phone: +86-755-23724206

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2024-12-24 (0.388 sec)