BGA assembly (Computers - Hardware)

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Item ID 1085516 in Category: Computers - Hardware

BGA assembly




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The kind of tests that can be carried out on the soldering does not enable one to determine whether the solder will be long-lasting or not. This solder joint may however fail after some time. X-ray is one of the testing methods for inspecting the BGA assembly solder joint while electrical tests are used in testing the electrical functionality of the product. One gets the benefit of looking through the solder joint below the BGAs. Because of this advantage, AXI, an automated X-ray inspection technique is preferred in the inspection of BGA.

Contact Info:-

High Quality PCB Co., Limited

Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China

Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China

Plant 2 address: Zhuhai, Guangdong, China

Plant 3 address: Dongguan, Guangdong, China

TEL: +86-755-23724206

WahtsApp: +86-189 2381 2997

Skype: shawnwang2006

Email: sales@efpcb.com


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Target Nation: All Nations
Target City : Shenzhen
Last Update : 30 September 2024 12:54 PM
Number of Views: 49
Item  Owner  : Shawn Wang
Contact Email:
Contact Phone: +86-755-23724206

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2024-11-23 (0.387 sec)